Natcast (short for The National Center for the Advancement of Semiconductor Technology) is a new, purpose-built, non-profit entity created to operate the National Semiconductor Technology Center (NSTC) consortium, established by the CHIPS Act of the U.S. government.
Working at Natcast represents an opportunity to help extend America’s leadership in semiconductor technology, significantly reduce the time and cost of moving from idea to commercialization, and build and sustain a semiconductor workforce development ecosystem.
These efforts to advance semiconductor technology and seed new industries built on the capabilities of a wide range of advanced chips hold the potential to benefit the country and the world for generations to come.
In this role you will pioneer next-generation semiconductor packaging solutions at Natcast's CHIPS for America R&D Flagship Facility, developing breakthrough technologies that revolutionize advanced packaging integration and performance.
Every day you will explore the frontiers of advanced packaging, working with novel materials and innovative techniques to solve complex challenges in 3D integration, heterogeneous computing, and thermal management.
To thrive in this role you must combine materials science expertise with creative engineering abilities, demonstrating both technical innovation and practical implementation skills while advancing America's semiconductor packaging capabilities.
At Natcast's cutting-edge research facility, you'll collaborate with industry leaders and research pioneers to develop packaging solutions that enable the next generation of semiconductor devices, maintaining U.S. leadership in advanced integration technologies.
Key Responsibilities
Research & Development:
Lead groundbreaking research initiatives in advanced semiconductor packaging, focusing on innovative 3D and 2.5D integration and heterogeneous computing solutions.
Develop and validate advanced packaging architectures that enhance device performance and enable system-level optimization.
Explore and evaluate novel materials for advanced packaging applications, such as dielectrics, interconnects, and thermal interface materials.
Design & Engineering:
Design cutting-edge packaging solutions, including 3D stacked and 2.5D architectures and heterogeneous integration methodologies.
Optimize thermal management systems to improve heat dissipation and maintain performance under demanding conditions.
Create and implement scalable integration processes for next-generation semiconductor packaging.
Prototyping & Validation:
Guide the development of prototypes to test and validate advanced packaging solutions.
Conduct performance evaluations and reliability testing to ensure packaging designs meet rigorous industry standards.
Utilize simulation and modeling tools to predict packaging behavior and refine integration strategies.
Collaboration & Leadership:
Collaborate with cross-functional teams, including materials scientists, process engineers, and design teams, to drive packaging innovation.
Mentor and lead research staff, fostering technical excellence and innovation within the team.
Build and strengthen partnerships with academic institutions and industry leaders to accelerate technology development.
Knowledge Dissemination:
Author technical publications and white papers to share research findings and establish thought leadership in advanced packaging.
Present research results at industry conferences, academic symposia, and internal strategy meetings.
Contribute to Natcast’s patent portfolio by developing innovative intellectual property in semiconductor packaging.
Required Skills and Experience
Ph.D. in Materials Science, Mechanical Engineering, or a related field.
5+ years of experience in semiconductor packaging research or development.
Expertise in 3D integration technologies, including stacked die and through-silicon via (TSV) solutions.
Strong background in materials science, with experience in novel materials for semiconductor packaging.
In-depth knowledge of thermal management techniques and methodologies.
Hands-on experience with process integration and prototyping.
Demonstrated ability to publish research findings in peer-reviewed journals or technical conferences.
Proven project leadership skills with experience driving cross-functional initiatives.
Exceptional analytical and problem-solving skills.
Bonus Qualifications
Industry experience in semiconductor packaging, particularly with large-scale production processes.
A robust patent portfolio showcasing innovations in advanced packaging.
Expertise in heterogeneous integration techniques, including chiplet architectures.
Experience in developing advanced materials for high-performance packaging solutions.
Proficiency in simulation and modeling tools to analyze and optimize packaging designs.
Ready to revolutionize semiconductor packaging technology? Join our mission-driven team and develop the integration solutions that will enable next-generation computing systems.
Natcast is an equal opportunity employer. We do not discriminate based on race, color, religion, gender, gender expression, age, national origin, disability, marital status, sexual orientation, military status, or any protected attribute. We encourage qualified candidates from all backgrounds to apply and join us in our mission. If you require accommodation at any stage of the application process due to a disability, please let us know.
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